Independent researcher, USA

Title of the Talk:
Multi‑Part Authentication & Tracking for Semiconductor Tools

Abstract of the Talk:
Semiconductor production depends on the precise assembly of deposition, lithography and MOCVD tools. Yet subtle mismatches or unrecorded part combinations can lead to defects, yield loss and delayed root‑cause analysis. This keynote introduces a comprehensive authentication and tracking system designed to solve these issues. Each consumable or mechanical part is encoded with a unique identifier and arranged into a “golden” multi‑dimensional array representing the correct kit. During assembly and maintenance, engineers scan kit codes; the system decodes the underlying part codes, compares them against the golden array and records them in a database that stores historical coupling data. By combining real‑time verification with data‑driven insights into part interactions and potential coupling effects, this approach ensures accurate tool configuration, reduces downtime and lays the groundwork for AI‑enabled process control.

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